CfgComponent#
- class pyedb.configuration.cfg_components.CfgComponent(_pedb=None, pedb_object=None, **kwargs)#
Bases:
pyedb.configuration.cfg_common.CfgBaseFluent builder for a single component entry.
Overview#
Retrieve model properties from the EDB design. |
|
Set component parameters to the EDB design. |
|
Retrieve component parameters from the EDB design. |
|
Append a pin-pair RLC model between two component pins. |
|
Assign a Touchstone S-parameter model to this component. |
|
Assign a SPICE subcircuit model to this component. |
|
Assign a raw netlist model to this component. |
|
Configure IC die and orientation properties. |
|
Configure solder-ball geometry for this component. |
|
Configure port reference geometry for this IC component. |
|
Serialize the component configuration. |
Import detail#
from pyedb.configuration.cfg_components import CfgComponent
Attribute detail#
- CfgComponent.pyedb_obj = None#
- CfgComponent.enabled#
- CfgComponent.reference_designator#
- CfgComponent.definition#
- CfgComponent.type#
- CfgComponent.placement_layer#
- CfgComponent.pins#
- CfgComponent.port_properties#
- CfgComponent.solder_ball_properties#
- CfgComponent.ic_die_properties#
- CfgComponent.pin_pair_model#
- CfgComponent.spice_model#
- CfgComponent.s_parameter_model#
- CfgComponent.netlist_model#
Method detail#
- CfgComponent.retrieve_model_properties_from_edb()#
Retrieve model properties from the EDB design.
- CfgComponent.set_parameters_to_edb()#
Set component parameters to the EDB design.
- CfgComponent.retrieve_parameters_from_edb()#
Retrieve component parameters from the EDB design.
- CfgComponent.add_pin_pair_rlc(first_pin: str, second_pin: str, resistance=None, inductance=None, capacitance=None, is_parallel: bool = False, resistance_enabled: bool = False, inductance_enabled: bool = False, capacitance_enabled: bool = False)#
Append a pin-pair RLC model between two component pins.
- Parameters:
- first_pin
str Name of the first pin, e.g.
"1".- second_pin
str Name of the second pin, e.g.
"2".- resistance
str,float,orNone,optional Resistance value, e.g.
"100ohm"or100.0.- inductance
str,float,orNone,optional Inductance value, e.g.
"1nH".- capacitance
str,float,orNone,optional Capacitance value, e.g.
"100nF".- is_parallelbool,
optional Truefor a parallel RLC topology. Default isFalse(series).- resistance_enabledbool,
optional Activate the resistance element. Default is
False.- inductance_enabledbool,
optional Activate the inductance element. Default is
False.- capacitance_enabledbool,
optional Activate the capacitance element. Default is
False.
- first_pin
Examples
>>> r1 = cfg.components.add("R1", part_type="resistor") >>> r1.add_pin_pair_rlc("1", "2", resistance="100ohm", resistance_enabled=True)
- CfgComponent.set_s_parameter_model(model_name: str, model_path: str, reference_net: str)#
Assign a Touchstone S-parameter model to this component.
- Parameters:
Examples
>>> u1.set_s_parameter_model("cap_100nF", "/snp/cap.s2p", "GND")
- CfgComponent.set_spice_model(model_name: str, model_path: str, sub_circuit: str = '', terminal_pairs=None)#
Assign a SPICE subcircuit model to this component.
- Parameters:
Examples
>>> u1.set_spice_model("ic_spice", "/spice/ic.sp", sub_circuit="IC_TOP")
- CfgComponent.set_netlist_model(netlist: str)#
Assign a raw netlist model to this component.
- Parameters:
- netlist
str SPICE-compatible netlist string.
- netlist
- CfgComponent.set_ic_die_properties(die_type: str = 'no_die', orientation: str = 'chip_up', height=None)#
Configure IC die and orientation properties.
- Parameters:
Examples
>>> u1.set_ic_die_properties("flip_chip", orientation="chip_down")
- CfgComponent.set_solder_ball_properties(shape: str = 'cylinder', diameter: str = None, height: str = None, material: str = 'solder', mid_diameter=None, orientation: str = 'chip_down', reference_designator: str = None)#
Configure solder-ball geometry for this component.
- Parameters:
- shape
str,optional Solder-ball shape.
"cylinder"(default),"spheroid", or"no_solder_ball".- diameter
str,optional Outer diameter, e.g.
"150um". When None and a live EDB session is attached the smallest pin pad size found on the component is used automatically. Falls back to"150um"if the pad size cannot be determined.- height
str,optional Solder-ball height, e.g.
"100um". When None the height is set to2 * diameter / 3.- material
str,optional Material name. Default is
"solder".- mid_diameter
strorNone,optional Mid-diameter for spheroid shape. Defaults to diameter when None.
- orientation
str,optional Die orientation for IC components.
"chip_down"(default) or"chip_up".- reference_designator
str,optional Override the component reference designator used when querying pin sizes from EDB. When None
self.reference_designatoris used.
- shape
Examples
>>> u1.set_solder_ball_properties("cylinder", "150um", "100um") >>> u1.set_solder_ball_properties() # auto-sizes from pin pads
- CfgComponent.set_port_properties(reference_height: str = '0', reference_size_auto: bool = True, reference_size_x: str = '0', reference_size_y: str = '0')#
Configure port reference geometry for this IC component.
- Parameters:
- reference_height
str,optional Port reference height, e.g.
"50um". Default is"0".- reference_size_autobool,
optional Let the solver auto-compute the reference size. Default is
True.- reference_size_x
str,optional Explicit reference size in X when reference_size_auto is
False. Default is"0".- reference_size_y
str,optional Explicit reference size in Y. Default is
"0".
- reference_height
Examples
>>> u1.set_port_properties(reference_height="50um")