place_instance#
- Stackup.place_instance(component_edb, angle=0.0, offset_x=0.0, offset_y=0.0, offset_z=0.0, flipped_stackup=True, place_on_top=True, solder_height=0)[source]#
Place current Cell into another cell using 3d placement method. Flip the current layer stackup of a layout if requested. Transform parameters currently not supported.
- Parameters:
- component_edb
Edb
Cell to place in the current layout.
- angle
double
,optional
The rotation angle applied on the design.
- offset_x
double
,optional
The x offset value. The default value is
0.0
.- offset_y
double
,optional
The y offset value. The default value is
0.0
.- offset_z
double
,optional
The z offset value. (i.e. elevation offset for placement relative to the top layer conductor). The default value is
0.0
, which places the cell layout on top of the top conductor layer of the target EDB.- flipped_stackupbool,
optional
Either if the current layout is inverted. If True and place_on_top is True the stackup will be flipped before the merge.
- place_on_topbool,
optional
Either if place the component_edb layout on Top or Bottom of destination Layout.
- solder_height
float
,optional
Solder Ball or Bumps eight. This value will be added to the elevation to align the two layouts.
- component_edb
- Returns:
- bool
True
when succeedFalse
if not.
Examples
>>> edb1 = Edb(edbpath=targetfile1, edbversion="2021.2") >>> edb2 = Edb(edbpath=targetfile2, edbversion="2021.2") >>> hosting_cmp = edb1.components.get_component_by_name("U100") >>> mounted_cmp = edb2.components.get_component_by_name("BGA") >>> edb1.stackup.place_instance(edb2, angle=0.0, offset_x="1mm", ... offset_y="2mm", flipped_stackup=False, place_on_top=True, ... )